The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Jun. 21, 2011
Applicants:

Hirotoshi Terada, Hamamatsu, JP;

Hiroyuki Matsuura, Hamamatsu, JP;

Inventors:

Hirotoshi Terada, Hamamatsu, JP;

Hiroyuki Matsuura, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 21/26 (2006.01); G01N 21/95 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); G01N 21/01 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); H01L 21/6838 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); G01N 21/01 (2013.01); H01L 22/12 (2013.01);
Abstract

A suction unitincludes a main body portion having a first surfaceon which a semiconductor wafer W is arranged and a second surfaceopposite to the first surface, and in which a through-holethat penetrates through the first surfaceand the second surfaceis formed and a light transmitting portion having a light incident surfaceand a light emitting surface, and which is fitted to the through-hole. Further, in the first surface, a first suction groovefor vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surfaceis formed, and in the second surface, a second suction groovefor vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surfaceis formed.


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