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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8946983 B1

PDFFull Text
Date of Patent:
Feb. 03, 2015

Filed:

May. 14, 2012

Phosphor-containing sheet, led light emitting device using the same, and method for manufacturing led

Applicants:

Nobuo Matsumura, Otsu, JP;

Takejiro Inoue, Otsu, JP;

Hironobu Sadakuni, Otsu, JP;

Yutake Ishida, Otsu, JP;

Kazunari Kawamoto, Otsu, JP;

Masahiro Yoshioka, Otsu, JP;

Tetsuya Goto, Otsu, JP;

Inventors:

Nobuo Matsumura, Otsu, JP;

Takejiro Inoue, Otsu, JP;

Hironobu Sadakuni, Otsu, JP;

Yutake Ishida, Otsu, JP;

Kazunari Kawamoto, Otsu, JP;

Masahiro Yoshioka, Otsu, JP;

Tetsuya Goto, Otsu, JP;

Assignee:

Toray Industries, Inc., Tokyo, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Tracie Y Green

Int. Cl.
CPC ...
F21K 99/00 (2010.01); H01L 33/50 (2010.01); C08J 5/18 (2006.01); C08L 83/04 (2006.01); H01L 23/00 (2006.01); C08G 77/04 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
F21K 9/56 (2013.01); H01L 33/502 (2013.01); C08J 5/18 (2013.01); C08L 83/04 (2013.01); H01L 24/83 (2013.01); F21K 9/90 (2013.01); H01L 2933/0041 (2013.01); C08J 2383/07 (2013.01); C08G 77/045 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/80 (2013.01); H01L 2224/83192 (2013.01);
Abstract

A phosphor-containing sheet having a storage modulus of 0.1 MPa or more at 25° C. and a storage modulus of less than 0.1 MPa at 100° C., wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction. This phosphor-containing sheet provides a phosphor sheet having good shapability and high adhesive power as a phosphor sheet bonded to an LED chip as a wavelength conversion layer.

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