The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Mar. 14, 2013
Applicant:
Mosaid Technologies Incorporated, Ottawa, Ontario, CA;
Inventors:
Sang-Hyun Yi, Suwon-si, KR;
Young-Nam Kim, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/528 (2006.01); H01L 21/822 (2006.01); H01L 27/06 (2006.01); H01L 27/11 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/8221 (2013.01); H01L 27/0688 (2013.01); H01L 27/11 (2013.01); H01L 27/1104 (2013.01); H01L 27/1108 (2013.01); H01L 27/1112 (2013.01); H01L 27/115 (2013.01); H01L 27/11521 (2013.01); H01L 27/11551 (2013.01); H01L 27/11568 (2013.01);
Abstract
A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.