The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Sep. 29, 2010
Applicants:
Rick Snyder, Windsor, CO (US);
Joel Philliber, Fort Collins, CO (US);
Inventors:
Rick Snyder, Windsor, CO (US);
Joel Philliber, Fort Collins, CO (US);
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 31/0203 (2014.01); H01L 31/102 (2006.01); H01L 29/66 (2006.01); H01L 23/06 (2006.01); H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/10 (2013.01); H01L 2224/29018 (2013.01); H01L 2224/29023 (2013.01); H01L 2224/29034 (2013.01); H01L 2224/29084 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/9202 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0132 (2013.01);
Abstract
A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.