The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Mar. 16, 2011
Applicants:

Margaret H. Abraham, Portola Valley, CA (US);

David P. Taylor, Hawthorne, CA (US);

Inventors:

Margaret H. Abraham, Portola Valley, CA (US);

David P. Taylor, Hawthorne, CA (US);

Assignee:

The Aerospace Corporation, El Segundo, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/02 (2006.01); H01L 21/02 (2006.01); H01L 29/207 (2006.01); H01L 23/58 (2006.01); H01L 21/265 (2006.01); C23C 14/10 (2006.01); C23C 14/14 (2006.01); C23C 14/48 (2006.01); C23C 14/54 (2006.01); C23C 14/58 (2006.01); H01L 21/268 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/26533 (2013.01); C23C 14/10 (2013.01); C23C 14/14 (2013.01); C23C 14/48 (2013.01); C23C 14/548 (2013.01); C23C 14/5806 (2013.01); H01L 21/26506 (2013.01); H01L 21/268 (2013.01); B81C 1/00507 (2013.01);
Abstract

Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same, are provided herein. A structure prepared using ion implantation may include a substrate; an embedded structure having pre-selected characteristics; and a film within or adjacent to the embedded structure. The film comprises a metal having a perturbed arrangement arising from the presence of the embedded structure. The perturbed arrangement may include metal ions that coalesce into a substantially continuous, electrically conductive metal layer, or that undergo covalent bonding, whereas in the absence of the embedded structure the metal ions instead may be free to diffuse through the substrate. The embedded structure may control the diffusion of the metal through the substrate and/or the reaction of the metal within the substrate.


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