The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Nov. 23, 2011
Applicants:
Mitsuaki Igeta, Yokohama, JP;
Takashi Suzuki, Kawasaki, JP;
Inventors:
Mitsuaki Igeta, Yokohama, JP;
Takashi Suzuki, Kawasaki, JP;
Assignees:
Fujitsu Limited, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/5228 (2013.01); H01L 23/5226 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate, a heat generating device, and a heat radiating part. The heat generating device is provided on the semiconductor substrate, and the heat radiating part is provided above the heat generating device. The heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part.