The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Mar. 28, 2012
Applicants:

Fumitsugu Fukuyo, Hamamatsu, JP;

Kenshi Fukumitsu, Hamamatsu, JP;

Naoki Uchiyama, Hamamatsu, JP;

Toshimitsu Wakuda, Hamamatsu, JP;

Inventors:

Fumitsugu Fukuyo, Hamamatsu, JP;

Kenshi Fukumitsu, Hamamatsu, JP;

Naoki Uchiyama, Hamamatsu, JP;

Toshimitsu Wakuda, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); C03C 23/00 (2006.01); B23K 26/03 (2006.01); B23K 26/04 (2014.01); B23K 26/06 (2014.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); B28D 5/00 (2006.01); C03B 33/023 (2006.01); C03B 33/08 (2006.01); C03B 33/10 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
C03C 23/0025 (2013.01); B23K 26/0057 (2013.01); B23K 26/03 (2013.01); B23K 26/032 (2013.01); B23K 26/034 (2013.01); B23K 26/046 (2013.01); B23K 26/0635 (2013.01); B23K 26/0656 (2013.01); B23K 26/073 (2013.01); B23K 26/0853 (2013.01); B23K 26/367 (2013.01); B23K 26/4075 (2013.01); B28D 5/0011 (2013.01); C03B 33/023 (2013.01); C03B 33/082 (2013.01); C03B 33/102 (2013.01); B23K 2201/40 (2013.01); B65G 2249/04 (2013.01); G02F 1/1368 (2013.01);
Abstract

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.


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