The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Oct. 30, 2009
Applicants:

Kinya Nakatsu, Hitachinaka, JP;

Hiroshi Hozoji, Hitachiota, JP;

Takeshi Tokuyama, Hitachi, JP;

Yusuke Takagi, Hitachinaka, JP;

Toshiya Satoh, Hitachiota, JP;

Taku Oyama, Hitachi, JP;

Takanori Ninomiya, Hiratsuka, JP;

Inventors:

Kinya Nakatsu, Hitachinaka, JP;

Hiroshi Hozoji, Hitachiota, JP;

Takeshi Tokuyama, Hitachi, JP;

Yusuke Takagi, Hitachinaka, JP;

Toshiya Satoh, Hitachiota, JP;

Taku Oyama, Hitachi, JP;

Takanori Ninomiya, Hiratsuka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H02M 7/00 (2006.01); B60L 11/14 (2006.01); B60L 11/18 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); B60L 11/14 (2013.01); B60L 11/18 (2013.01); H05K 7/20927 (2013.01); H01L 24/33 (2013.01); Y02T 10/7005 (2013.01); Y02T 10/7077 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.


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