The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Sep. 30, 2010
Applicants:

Takafumi Kashiwagi, Osaka, JP;

Yukio Sakai, Osaka, JP;

Nobuhiro Tada, Osaka, JP;

Takayuki Hiruma, Osaka, JP;

Inventors:

Takafumi Kashiwagi, Osaka, JP;

Yukio Sakai, Osaka, JP;

Nobuhiro Tada, Osaka, JP;

Takayuki Hiruma, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/28 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 24/97 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0218 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09309 (2013.01); H05K 2203/1316 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 μm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.


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