The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Mar. 14, 2013
Applicant:
Momentive Performance Materials Inc., Waterford, NY (US);
Inventors:
Chandrashekar Raman, North Royalton, OH (US);
Bei Xiang, Strongsville, OH (US);
Anand Murugaiah, Strongsville, OH (US);
Assignee:
Momentive Performance Materials Inc., Waterford, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/38 (2006.01); C08K 3/20 (2006.01); B32B 19/04 (2006.01); C08K 5/5425 (2006.01); C08K 5/54 (2006.01); C08K 3/22 (2006.01); C08K 13/02 (2006.01); B29C 47/64 (2006.01); C08J 3/20 (2006.01); B29B 7/42 (2006.01); B29B 7/48 (2006.01); B29C 47/38 (2006.01); B29C 47/60 (2006.01); B29C 47/00 (2006.01); B29B 7/84 (2006.01); B29B 7/90 (2006.01);
U.S. Cl.
CPC ...
C08K 3/38 (2013.01); C08K 5/5425 (2013.01); C08K 5/5403 (2013.01); C08K 3/22 (2013.01); C08K 5/54 (2013.01); C08K 13/02 (2013.01); B29C 47/64 (2013.01); C08J 3/203 (2013.01); B29B 7/421 (2013.01); B29B 7/482 (2013.01); B29C 47/385 (2013.01); B29C 47/6031 (2013.01); B29C 47/605 (2013.01); B29C 47/0009 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); B29B 7/845 (2013.01); B29B 7/90 (2013.01);
Abstract
A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.