The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Jun. 28, 2011
Applicants:

Bhawna Kulshreshtha, Linz, AT;

Luc Monnissen, Arsimont, BE;

Laurent Blayac, Saint Nazaire, FR;

Inventors:

Bhawna Kulshreshtha, Linz, AT;

Luc Monnissen, Arsimont, BE;

Laurent Blayac, Saint Nazaire, FR;

Assignee:

Borealis AG, Vienna, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/20 (2006.01); B29C 45/00 (2006.01); C08L 23/04 (2006.01); C08L 23/06 (2006.01); C08K 3/34 (2006.01); C08K 3/00 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08K 5/20 (2013.01); C08L 23/04 (2013.01); C08L 23/06 (2013.01); C08K 3/34 (2013.01); B29C 45/0001 (2013.01); C08K 3/0033 (2013.01); C08K 5/005 (2013.01);
Abstract

Bimodal high density polyethylene composition for producing molded articles comprising—an ethylene homopolymer or an ethylene alpha-olefin copolymer which is a bimodal high density polymer (COMPONENT A) in combination with—an alphanucleating agent (COMPONENT B),—a slip agent being a primary fatty acid amide, (COMPONENT C) and—one or more additives selected from antioxidants, acid scavengers, pigments and UV-stabilizers (COMPONENT D), the composition showing an increased the crystallization temperature and a decreased coefficient of friction compared to a bimodal HDPE composition prepared with the sole use of nucleating agent and compared to the sole use of a slip agent; and its use for producing injection molded articles, especially caps and closures.


Find Patent Forward Citations

Loading…