The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Aug. 19, 2009
Joo-han Kim, Yongin-si, KR;
Ki-yong Song, Seoul, KR;
Dong-ju Yang, Seoul, KR;
Hee-joon Kim, Cheonan-si, KR;
Yeo-geon Yoon, Seoul, KR;
Sung-hen Cho, Seoul, KR;
Chang-hoon Kim, Cheonan-si, KR;
Jae-hong Kim, Seoul, KR;
Yu-gwang Jeong, Yongin-si, KR;
Ki-yeup Lee, Seoul, KR;
Sang-gab Kim, Seoul, KR;
Yun-jong Yeo, Seoul, KR;
Shin-il Choi, Seoul, KR;
Ji-young Park, Suwon-si, KR;
Joo-Han Kim, Yongin-si, KR;
Ki-Yong Song, Seoul, KR;
Dong-Ju Yang, Seoul, KR;
Hee-Joon Kim, Cheonan-si, KR;
Yeo-Geon Yoon, Seoul, KR;
Sung-Hen Cho, Seoul, KR;
Chang-Hoon Kim, Cheonan-si, KR;
Jae-Hong Kim, Seoul, KR;
Yu-Gwang Jeong, Yongin-si, KR;
Ki-Yeup Lee, Seoul, KR;
Sang-Gab Kim, Seoul, KR;
Yun-Jong Yeo, Seoul, KR;
Shin-Il Choi, Seoul, KR;
Ji-Young Park, Suwon-si, KR;
Samsung Display Co., Ltd., , KR;
Abstract
A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.