The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Aug. 24, 2010
Applicants:

Nobuyuki Kobayashi, Tokyo, JP;

Takanori Sannan, Tokyo, JP;

Shinya Tsuchida, Tokyo, JP;

Yoshihiko Iijima, Tokyo, JP;

Inventors:

Nobuyuki Kobayashi, Tokyo, JP;

Takanori Sannan, Tokyo, JP;

Shinya Tsuchida, Tokyo, JP;

Yoshihiko Iijima, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/04 (2006.01); C09D 5/24 (2006.01); H01G 11/38 (2013.01); H01M 4/13 (2010.01); H01M 4/139 (2010.01); H01M 4/62 (2006.01); H01M 4/66 (2006.01); C09D 101/28 (2006.01); C09D 103/08 (2006.01); C09D 105/04 (2006.01); C09D 105/08 (2006.01); C08L 1/28 (2006.01); C08L 3/08 (2006.01); C08L 5/04 (2006.01); C08L 5/08 (2006.01); H01G 11/26 (2013.01); H01G 11/28 (2013.01); H01M 4/583 (2010.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); H01G 11/38 (2013.01); H01M 4/0404 (2013.01); H01M 4/13 (2013.01); H01M 4/139 (2013.01); H01M 4/622 (2013.01); H01M 4/667 (2013.01); C09D 101/284 (2013.01); C09D 101/286 (2013.01); C09D 103/08 (2013.01); C09D 105/04 (2013.01); C09D 105/08 (2013.01); C08L 1/284 (2013.01); C08L 1/286 (2013.01); C08L 3/08 (2013.01); C08L 5/04 (2013.01); C08L 5/08 (2013.01); H01G 11/26 (2013.01); H01G 11/28 (2013.01); H01M 4/583 (2013.01); H01M 4/625 (2013.01); H01M 10/0525 (2013.01); Y02E 60/122 (2013.01); Y02E 60/13 (2013.01);
Abstract

A water-based coating formulation for an electrode plate of an electricity storage device, said water-based coating formulation being adapted to form a coating film layer on the electrode plate, contains at least one resin binder having a saponification degree of 40% or higher and selected from unmodified and modified polyvinyl alcohols and unmodified and modified ethylene-vinyl alcohol copolymers, an electrically conductive material, and a specific polybasic acid or its acid anhydride in a water-based medium containing water as a polar solvent. Per parts by mass of the electrically conductive material (2), the resin binder is from 0.1 to 3 parts by mass and the polybasic acid or the like is from 0.01 to 6 parts by mass. The coating formulation has a solids content from 0.02 mass % to 40 mass %.


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