The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
May. 31, 2010
Shigenobu Ikenaga, Chiba, JP;
Takashi Hakuta, Sodegaura, JP;
Kazuhiro Yarimizu, Fujisawa, JP;
Hiroshi Mori, Ichihara, JP;
Takanobu Murofushi, Ichihara, JP;
Hirofumi Zenkoh, Chiba, JP;
Jun Tokuhiro, Shinagawa-ku, JP;
Fumito Takeuchi, Chiba, JP;
Shigenobu Ikenaga, Chiba, JP;
Takashi Hakuta, Sodegaura, JP;
Kazuhiro Yarimizu, Fujisawa, JP;
Hiroshi Mori, Ichihara, JP;
Takanobu Murofushi, Ichihara, JP;
Hirofumi Zenkoh, Chiba, JP;
Jun Tokuhiro, Shinagawa-ku, JP;
Fumito Takeuchi, Chiba, JP;
Mitsui Chemicals Tohcello, Inc., Tokyo, JP;
Abstract
An ethylene resin composition is provided which has excellent properties including adhesion properties, electrically insulating properties, transparency, moldability and process stability and can be produced without requiring any cross-linking procedure if necessary to improve productivity; and others. The ethylene resin composition contains a modified product produced by modifying an ethylene polymer (A) that meets all of the requirements a) to e) mentioned below with an ethylenically unsaturated silane compound (B). a) The density is 900 to 940 kg/m. b) The melting peak temperature is 90 to 125 ° C. as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190 ° C. and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm.