The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Jan. 25, 2012
Applicants:

Nicholas A. Zafiropoulos, Newton, MA (US);

Paul Nahass, Cambridge, MA (US);

Roxana Trifu, Worcester, MA (US);

Redouane Begag, Hudson, MA (US);

Wendell E. Rhine, Belmont, MA (US);

Wenting Dong, Marlborough, MA (US);

Shannon White, Hudson, MA (US);

George L. Gould, Mendon, MA (US);

Alaric Naiman, Lincoln, MA (US);

Roger Sinta, Woburn, MA (US);

Inventors:

Nicholas A. Zafiropoulos, Newton, MA (US);

Paul Nahass, Cambridge, MA (US);

Roxana Trifu, Worcester, MA (US);

Redouane Begag, Hudson, MA (US);

Wendell E. Rhine, Belmont, MA (US);

Wenting Dong, Marlborough, MA (US);

Shannon White, Hudson, MA (US);

George L. Gould, Mendon, MA (US);

Alaric Naiman, Lincoln, MA (US);

Roger Sinta, Woburn, MA (US);

Assignee:

Aspen Aerogels, Inc., Northborough, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/10 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02126 (2013.01); H01L 21/02118 (2013.01); H01L 21/02203 (2013.01); H01L 21/02282 (2013.01); H01L 21/31058 (2013.01); C08L 79/08 (2013.01);
Abstract

Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided.


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