The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Sep. 21, 2011
Matthew C. Everhart, Fairborn, OH (US);
David E. Havens, Bellbrook, OH (US);
Randy Rex Kysar, Derby, KS (US);
Carl Ray Fiegenbaum, Rose Hill, KS (US);
Jeffrey W. Priest, Rose Hill, KS (US);
Delbert Leon Strelow, Wichita, KS (US);
Kodi Elizabeth Ann Caster, Wichita, KS (US);
Matthew C. Everhart, Fairborn, OH (US);
David E. Havens, Bellbrook, OH (US);
Randy Rex Kysar, Derby, KS (US);
Carl Ray Fiegenbaum, Rose Hill, KS (US);
Jeffrey W. Priest, Rose Hill, KS (US);
Delbert Leon Strelow, Wichita, KS (US);
Kodi Elizabeth Ann Caster, Wichita, KS (US);
Spirit AreoSystems, Inc., Wichita, KS (US);
Abstract
A method and apparatus for fabricating a composite part, such as a fuselage or internal stiffener, with a shape memory polymer (SMP) apparatus usable as a rigid lay-up tool. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. For example, cavities may be formed into the SMP apparatus for nesting components therein to co-bond or co-cure with the composite part. The composite material and/or nested components may be heated and compressed against the SMP apparatus. The SMP apparatus may be configured to remain rigid during the composite cure cycle. Once the composite material is cured, the SMP apparatus may be triggered to a malleable state and urged away from the cured composite material.