The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Nov. 28, 2011
Applicants:

Kunihiko Mineya, Osaka, JP;

Tatsuki Hiraoka, Hyogo, JP;

Inventors:

Kunihiko Mineya, Osaka, JP;

Tatsuki Hiraoka, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 6/00 (2006.01); H01M 2/00 (2006.01); H01M 2/02 (2006.01); H01M 10/0587 (2010.01); H01M 2/16 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
H01M 10/0587 (2013.01); H01M 2/1673 (2013.01); H01M 10/052 (2013.01); Y02E 60/122 (2013.01);
Abstract

A positive electrode plate, a separator, and a negative electrode plateare prepared. The positive electrode plate, the separator, and the negative electrode plateare combined so as to form a spirally-wound electrode assembly. A winding end portionof the electrode assemblyis fixed with a heat-sensitive adhesive (preferably, a heat-sensitive adhesive tape) whose adhesive force can be reduced by heating or cooling. The electrode assemblyis placed in an outer casing, and then the ambient temperature of the electrode assemblyis adjusted so that the electrode assemblyis loosened due to reduction in the adhesive force of the heat-sensitive adhesive. An electrolyte solution is injected into the outer casing


Find Patent Forward Citations

Loading…