The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Dec. 02, 2009
Applicants:
Sun-hwa Lee, Paju-si, KR;
Hyun-ho Shin, Anyang-si, KR;
Keon-soo Nah, Paju-si, KR;
Inventors:
Assignee:
LG Display Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 5/04 (2006.01); H01L 33/58 (2010.01); G02B 5/02 (2006.01); G02B 19/00 (2006.01); F21K 99/00 (2010.01); G02F 1/1335 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); G02B 5/02 (2013.01); G02B 19/0066 (2013.01); G02B 19/0028 (2013.01); F21K 9/00 (2013.01); G02F 1/133603 (2013.01); H01L 2933/0091 (2013.01); F21Y 2101/02 (2013.01);
Abstract
Disclosed are a high efficiency LED package with reduced production costs, a method for manufacturing the same, and a light source unit having the LED package. The method for manufacturing the LED package includes preparing a mold frame on which an LED is mounted, forming a hemi-spherical lens having a reverse-conical top part and a lateral part with haze formed by sanding or bead treatment, and fixing the lens to the mold frame to enclose the LED.
Quick Actions:
Lee, Sun-Hwa. (2015). Light emitting diode package, method for manufacturing the same and light source unit having the led package (U.S. Patent No. 8944643). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8944643
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile