The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Dec. 28, 2011
Applicants:

Katsunori Ogata, Nagaokakyo, JP;

Miyuki Mizukami, Nagaokakyo, JP;

Inventors:

Katsunori Ogata, Nagaokakyo, JP;

Miyuki Mizukami, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H01G 13/00 (2013.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 13/006 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

An electronic component manufacturing apparatus includes a first plate and a second plate such that a first surface of an electronic component chip is in contact with a first elastic layer of the first plate and a second surface of the electronic component chip is in contact with a second elastic layer of the second plate. The electronic component manufacturing apparatus further includes a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof and a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, the first and second plates in accordance with a turning path of the electronic component chip.


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