The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jan. 19, 2013
International Business Machines Corporation, Armonk, NY (US);
Anthony E. Baker, Stittsville, CA;
Lenovo Enterprise Solutions (Singapore) Pte. Ltd., New Tech Park, SG;
Abstract
A printed circuit board (PCB) stackup includes conductive layers and insulating layers interleaved among the conductive layers. The conductive layers include one or more power layers, one or more ground layers, one or more high-frequency layers, and one or more low-frequency layers. One or more first signals having one or more first frequencies greater than a first threshold are communicated over the high-frequency layers. One or more second signals having one or more second frequencies less than a second threshold are communicated over the low-frequency layers. Each second frequency is less than each first frequency. The insulating layers include one or more core layers and one or more prepreg layers arranged in alternating fashion. Each insulating layer adjacent to any high-frequency layer has a first material type. Each insulating layer not adjacent to any high-frequency layer has a second material type different than the first material type.