The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Sep. 11, 2012
Applicants:

Koichi Banno, Nagaokakyo, JP;

Shoichiro Suzuki, Nagaokakyo, JP;

Masanori Nakamura, Nagaokakyo, JP;

Masahiro Otsuka, Nagaokakyo, JP;

Taisuke Kanzaki, Nagaokakyo, JP;

Akihiro Shiota, Nagaokakyo, JP;

Inventors:

Koichi Banno, Nagaokakyo, JP;

Shoichiro Suzuki, Nagaokakyo, JP;

Masanori Nakamura, Nagaokakyo, JP;

Masahiro Otsuka, Nagaokakyo, JP;

Taisuke Kanzaki, Nagaokakyo, JP;

Akihiro Shiota, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Nagaokako-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/008 (2006.01); C04B 35/01 (2006.01); C04B 35/468 (2006.01); H01G 4/30 (2006.01); H01C 7/00 (2006.01); H01F 5/00 (2006.01); H01L 41/083 (2006.01); H05K 1/03 (2006.01); H01C 7/18 (2006.01); H01F 17/00 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); C04B 35/01 (2013.01); C04B 35/016 (2013.01); C04B 35/4682 (2013.01); H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H01C 7/008 (2013.01); H01F 5/00 (2013.01); H01G 4/306 (2013.01); H01L 41/083 (2013.01); H05K 1/0306 (2013.01); H01C 7/18 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3263 (2013.01); C04B 2235/3272 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/3409 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6584 (2013.01); H01F 17/0013 (2013.01); H01G 4/12 (2013.01);
Abstract

Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and Al/Si alloy-containing internal electrodes at a plurality of specific interface between ceramic layers; and an external electrode formed on the outer surface of the laminate, wherein the Al/Si ratio of the Al/Si alloy is 85/15 or more.


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