The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Aug. 10, 2012
Myung Jun Park, Chungcheongbuk-do, KR;
Sang Hoon Kwon, Gyunggi-do, KR;
Chang Hoon Kim, Gyunggi-do, KR;
Hyun Hee Gu, Gyunggi-do, KR;
Jae Young Park, Seoul, KR;
Da Young Choi, Gyunggi-do, KR;
Kyu Ha Lee, Gyunggi-do, KR;
Byung Jun Jeon, Seoul, KR;
Myung Jun Park, Chungcheongbuk-do, KR;
Sang Hoon Kwon, Gyunggi-do, KR;
Chang Hoon Kim, Gyunggi-do, KR;
Hyun Hee Gu, Gyunggi-do, KR;
Jae Young Park, Seoul, KR;
Da Young Choi, Gyunggi-do, KR;
Kyu Ha Lee, Gyunggi-do, KR;
Byung Jun Jeon, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-Do, KR;
Abstract
There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.