The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Apr. 19, 2013
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yasuhiro Hara, Tokyo, JP;

Masaki Sato, Tokyo, JP;

Torao Misono, Tokyo, JP;

Wataru Nakahori, Tokyo, JP;

Haruhiko Sanae, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the coil unitA of the power supply device, the U-shaped plateC constituting the U-shaped terminalis used to electrically connect the print-coil substrates. Further, the print-coil substratesconstituting the coil unitA can be connected to the main circuit substratealso by using the U-shaped terminal. Here, the print-coil substrateis connected to the print-coil substrateby using the U-shaped terminal, by which soldering for fixing the U-shaped terminalis performed from the lower face side of the print-coil substrate. Therefore, as compared with a conventional constitution where soldering is performed from both sides of the stacked print-coil substrates, the print coils can be connected by soldering only from one side face, thus making it possible to reduce the amount of work necessary for connecting the print coils.


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