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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8941220 B1

PDFFull Text
Expired
Date of Patent:
Jan. 27, 2015

Filed:

May. 30, 2012

Power module package and system module having the same

Applicants:

Kwang Soo Kim, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Seog Moon Choi, Gyunggi-do, KR;

Sung Keun Park, Gyunggi-do, KR;

Inventors:

Kwang Soo Kim, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Seog Moon Choi, Gyunggi-do, KR;

Sung Keun Park, Gyunggi-do, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;

Attorney:

Ladas & Parry, LLP

Primary Examiner:

Ori Nadav

Assistant Examiner:

Ernest Allen, III

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49575 (2013.01); H01L 23/49833 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/13034 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/4847 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

Find Patent Forward Citations

Kim, Kwang. (2015). Power module package and system module having the same (U.S. Patent No. 8941220). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8941220

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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