The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jan. 05, 2011
Applicant:
Yoji Nagano, Chigasaki, JP;
Inventor:
Yoji Nagano, Chigasaki, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/04 (2006.01); H05K 5/06 (2006.01); H05K 3/34 (2006.01); H03H 9/10 (2006.01); H05K 9/00 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); H03H 9/1021 (2013.01); H05K 9/0026 (2013.01); H05K 1/0306 (2013.01); H05K 1/111 (2013.01); H05K 3/0014 (2013.01); H05K 3/0052 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/0108 (2013.01);
Abstract
An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.