The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jun. 05, 2013
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Ryo Ogawa, Kawasaki, JP;
Seiji Okada, New Hyde Park, NY (US);
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 3/28 (2006.01); C08F 2/46 (2006.01); C08G 61/04 (2006.01); C08F 12/32 (2006.01); C08F 212/32 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
C08F 12/32 (2013.01); C08F 212/32 (2013.01); H05K 1/032 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10121 (2013.01);
Abstract
An optical component and an electrical board that have a low coefficient of linear expansion and small mold shrinkage, a method for producing the optical component, and a method for producing the electronic board are provided. An optical component includes a polymer having a repeating structural unit represented by general formula (1) where Rand Reach independently represent —H or —CH; m and n each independently represent an integer in the range of 0 to 3; asterisk denotes a dangling bond that bonds to one of Xa and Xb; and —H bonds to the other one of Xa and Xb.