The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Sep. 21, 2011
Applicant:
Noriyuki Kimura, Chiba, JP;
Inventor:
Noriyuki Kimura, Chiba, JP;
Assignee:
Seiko Instruments Inc., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 21/565 (2013.01); H01L 23/49846 (2013.01); H01L 23/49827 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/4848 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 24/49 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 24/45 (2013.01); H01L 2224/45015 (2013.01);
Abstract
In a method of manufacturing a ball grid array (BGA) semiconductor package, micro balls are mounted onto a respective plurality of through-holes formed in a substrate, and a semiconductor device is mounted on a die pad portion of the substrate. The semiconductor device and the micro balls are electrically connected with bonding wires. The semiconductor device, the die pad portion, the bonding wires, and parts of the micro balls are sealed together with an insulating resin to form an encapsulation member. The encapsulation member and the substrate are then cut into individual BGA semiconductor packages.