The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Aug. 09, 2013
Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe-shi, JP;
Shinko Leadmikk Co., Ltd., Kitakyushu-shi, JP;
Yasushi Masago, Shimonoseki, JP;
Koichi Taira, Shimonoseki, JP;
Toshiyuki Mitsui, Kitakyushu, JP;
Junichi Kakumoto, Kitakyushu, JP;
Kobe Steel, Ltd., Kobe-shi, JP;
Shinko Leadmikk Co., Ltd., Kitakyushu-shi, JP;
Abstract
A copper sheet is adjusted to have arithmetic mean roughness Ra of from 0.5 μm to 4.0 μm in a direction parallel to a sliding direction upon connection, mean projection-depression interval of from 0.01 mm to 0.3 mm in the direction, skewness of less than 0, and protrusion peak portion height of 1 μm or less. A Sn surface coating layer group X as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is adjacent to each side of each Sn coating layer. Maximum height roughness is 10 μm or less in a direction of part insertion. The sheet is surface-roughened by pressing when stamped, thereby forming depressions as a plurality of parallel lines in its surface. The sheet is then plated with Cu and Sn, followed by reflowing.