The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Sep. 22, 2011
Applicants:
Arata Kishi, Nara, JP;
Naomichi Ohashi, Hyogo, JP;
Atsushi Yamaguchi, Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); C08K 3/08 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); C08K 5/09 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/04 (2013.01); H05K 3/321 (2013.01); H01L 24/13 (2013.01); C08K 3/08 (2013.01); H05K 3/12 (2013.01); H05K 3/4069 (2013.01); H05K 2201/0272 (2013.01); H05K 2203/0425 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/81874 (2013.01); H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/00013 (2013.01); C08K 5/09 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size Lof 20 to 30 μm and solder particles having a particle size Lof 8 to 12 μm, and a mixing ratio of the Sn—Bi system solder powder is such that the solder particles having a particle size of 20 to 30 μm occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12 μm.