The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Aug. 22, 2011
Applicants:

Yi Cui, Stanford, CA (US);

Hui Wu, Mountain View, CA (US);

Liangbing HU, Mountain View, CA (US);

Inventors:

Yi Cui, Stanford, CA (US);

Hui Wu, Mountain View, CA (US);

Liangbing Hu, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); H01B 1/08 (2006.01); B82Y 20/00 (2011.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B82Y 30/00 (2013.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

In accordance with various example embodiments, an apparatus includes two or more circuit nodes and a conductive material that is located between and configured to electrically couple the circuit nodes. The conductive material includes a network of elongated portions of at least one electrospun Cu-based nanostructure. Each elongated portion has an aspect ratio of at least 50,000 and a length that is greater than 100 microns, and at least one fused crossing point that joins with a fused crossing point of another of the elongated portions. The network of elongated portions is distributed and aligned in the conductive material to set a conductance level and a transparency level along the network, along at least one direction.


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