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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8940186 B1

PDFFull Text
Date of Patent:
Jan. 27, 2015

Filed:

Oct. 22, 2012

Insulating layer composition for substrate, and prepreg and substrate using the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Soo Young Ji, Suwon, KR;

Suk Jin Ham, Suwon, KR;

Seung Hwan Kim, Suwon, KR;

Do Young Kim, Suwon, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon, KR;

Attorney:
Primary Examiner:

Geraldina Visconti

Int. Cl.
CPC ...
C09K 19/34 (2006.01); C09K 19/06 (2006.01); C08G 61/02 (2006.01); C08J 3/00 (2006.01); C09K 5/00 (2006.01); C08K 5/15 (2006.01); D21H 17/17 (2006.01); C08K 5/1515 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C09K 19/38 (2006.01); C09D 167/02 (2006.01); C09D 177/00 (2006.01); C09D 177/10 (2006.01); C09D 179/08 (2006.01); C08G 73/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); C08J 5/24 (2013.01); C09K 19/3483 (2013.01); C09K 19/3823 (2013.01); C09D 167/02 (2013.01); C09D 177/00 (2013.01); C09D 177/10 (2013.01); C09D 179/085 (2013.01); C08G 73/123 (2013.01); C08G 73/125 (2013.01); C08G 73/126 (2013.01); C08G 73/128 (2013.01); C08J 2367/02 (2013.01); H05K 1/0346 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0141 (2013.01);
Abstract

Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimensional change due to heat can be minimized when the insulating layer composition is used as an insulation material of the substrate, resulting in a substrate having improved thermal stability.

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