The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Aug. 22, 2012
Applicants:

Robert Alexander Wagner, Vienna, AT;

Adisa Cokovic, Krems an der Donau, AT;

Harald Trachsler, Rohrendorf, AT;

Karin Lepedat, Vienna, AT;

Inventors:

Robert Alexander Wagner, Vienna, AT;

Adisa Cokovic, Krems an der Donau, AT;

Harald Trachsler, Rohrendorf, AT;

Karin Lepedat, Vienna, AT;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/00 (2006.01); C09J 101/00 (2006.01); C09J 201/00 (2006.01); B29C 65/00 (2006.01); B31B 1/60 (2006.01); B32B 37/00 (2006.01); C08K 5/34 (2006.01); C08K 5/3445 (2006.01); B32B 7/12 (2006.01); C08K 5/55 (2006.01); C08L 61/32 (2006.01); B32B 21/02 (2006.01); B32B 21/06 (2006.01); C08L 61/28 (2006.01); D21H 27/22 (2006.01); B29K 61/20 (2006.01); B29L 7/00 (2006.01); D21H 17/49 (2006.01); D21H 17/51 (2006.01); C08K 5/21 (2006.01); C08K 5/31 (2006.01); C08K 5/39 (2006.01); C08K 5/405 (2006.01);
U.S. Cl.
CPC ...
C08L 61/32 (2013.01); B32B 21/02 (2013.01); B32B 21/06 (2013.01); C08L 61/28 (2013.01); D21H 27/22 (2013.01); B29K 2061/20 (2013.01); B29K 2995/0022 (2013.01); B29L 2007/002 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2307/406 (2013.01); D21H 17/49 (2013.01); D21H 17/51 (2013.01); C08K 5/21 (2013.01); C08K 5/31 (2013.01); C08K 5/39 (2013.01); C08K 5/405 (2013.01);
Abstract

A high gloss laminated panel is manufactured by applying a layer of a resin composition on a substrate layer and applying elevated pressure at elevated temperature for a time sufficient to at least partially cure the resin preferably without back-cooling. The resin composition includes a melamine formaldehyde resin in water and further includes one or more additives chosen from the group of thiourea, 1-amino-2-thiourea, stabilized guanidine, thio-acetamide, or an additive.


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