The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Jun. 30, 2009
Applicant:

Masayoshi Kotake, Tokyo, JP;

Inventor:

Masayoshi Kotake, Tokyo, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/26 (2006.01); H01L 51/00 (2006.01); H05K 3/20 (2006.01); H05K 3/04 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0016 (2013.01); H01L 51/0013 (2013.01); H05K 3/207 (2013.01); H01L 51/003 (2013.01); H05K 3/046 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0528 (2013.01);
Abstract

The present invention provides a new method for manufacturing an electronic part, which is capable of reducing the number of steps of superpose-printing, achieving positional accuracy (alignment accuracy) of precise superposed patterns, and layering with substantially no difference in level, thereby improving productivity and dimensional accuracy and eliminating defects. The method for manufacturing an electronic part includes the steps of forming a composite ink pattern layer on a releasing surface of a transfer plate using a relief offset method, and then simultaneously reversely transferring the composite ink pattern layer to a printing object. Various organic transistor elements are formed by combining a conductive ink, an insulating ink, and an ink containing a semiconductor.


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