The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Aug. 02, 2011
Applicants:

Xing-fu Zhong, Rolla, MO (US);

John Moore, Camarillo, CA (US);

Inventors:

Xing-Fu Zhong, Rolla, MO (US);

John Moore, Camarillo, CA (US);

Assignee:

Brewer Science Inc., Rolla, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 (2006.01); C11D 1/22 (2006.01); C11D 3/20 (2006.01); C11D 3/43 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
C11D 3/2003 (2013.01); B08B 3/024 (2013.01); B08B 3/04 (2013.01); B08B 3/041 (2013.01); C11D 1/22 (2013.01); C11D 3/43 (2013.01); C11C 11/0047 (2013.01);
Abstract

A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.


Find Patent Forward Citations

Loading…