The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Mar. 14, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Sangki Lee, Asan-si, KR;
Insik Kim, Asan-si, KR;
Teaseog Um, Asan-si, KR;
Suklae Kim, Cheonan-si, KR;
Yoonoh Han, Asan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01); H01R 12/50 (2011.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
H01R 23/70 (2013.01); G01R 1/0466 (2013.01); G01R 1/0483 (2013.01);
Abstract
A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.