The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Nov. 12, 2012
Applicants:

Jorg Scholvin, Cambridge, MA (US);

Anthony Zorzos, Cambridge, MA (US);

Clifton Fonstad, Arlington, MA (US);

Edward Boyden, Chestnut Hill, MA (US);

Inventors:

Jorg Scholvin, Cambridge, MA (US);

Anthony Zorzos, Cambridge, MA (US);

Clifton Fonstad, Arlington, MA (US);

Edward Boyden, Chestnut Hill, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); G01R 1/073 (2006.01); H01R 4/02 (2006.01); B23K 20/00 (2006.01); C25D 3/00 (2006.01); H01R 13/03 (2006.01); H05K 1/00 (2006.01); H05K 3/24 (2006.01); C25D 5/02 (2006.01); C23C 18/16 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07314 (2013.01); H01R 4/027 (2013.01); B23K 20/00 (2013.01); C25D 3/00 (2013.01); H01R 13/03 (2013.01); H05K 1/00 (2013.01); H05K 3/242 (2013.01); C25D 5/022 (2013.01); C23C 18/1608 (2013.01); H05K 1/18 (2013.01); H05K 2201/10083 (2013.01);
Abstract

In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up 'bumps' that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.


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