The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Feb. 09, 2012
Jiping LI, Palo Alto, CA (US);
Blake Koelmel, Mountain View, CA (US);
Aaron Muir Hunter, Santa Cruz, CA (US);
Wolfgang R. Aderhold, Cupertino, CA (US);
Jiping Li, Palo Alto, CA (US);
Blake Koelmel, Mountain View, CA (US);
Aaron Muir Hunter, Santa Cruz, CA (US);
Wolfgang R. Aderhold, Cupertino, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
The present invention generally relates to methods of cooling a substrate during rapid thermal processing. The methods generally include positioning a substrate in a chamber and applying heat to the substrate. After the temperature of the substrate is increased to a desired temperature, the substrate is rapidly cooled. Rapid cooling of the substrate is facilitated by increasing a flow rate of a gas through the chamber. Rapid cooling of the substrate is further facilitated by positioning the substrate in close proximity to a cooling plate. The cooling plate removes heat from substrate via conduction facilitated by gas located therebetween. The distance between the cooling plate and the substrate can be adjusted to create a turbulent gas flow therebetween, which further facilitates removal of heat from the substrate. After the substrate is sufficiently cooled, the substrate is removed from the chamber.