The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Apr. 30, 2013
Applicant:
Nissei Plastic Industrial Co., Ltd., Nagano, JP;
Inventor:
Toru Ikeda, Nagano, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 45/00 (2006.01); B29C 45/07 (2006.01); B29C 45/23 (2006.01); B29C 45/32 (2006.01); B29C 45/04 (2006.01); B29C 67/24 (2006.01); B29K 83/00 (2006.01); B29C 45/17 (2006.01); B29C 45/42 (2006.01);
U.S. Cl.
CPC ...
B29C 45/076 (2013.01); B29C 45/231 (2013.01); B29C 45/32 (2013.01); B29C 45/322 (2013.01); B29C 45/0416 (2013.01); B29C 67/246 (2013.01); B29K 2083/005 (2013.01); B29C 45/1761 (2013.01); B29C 45/42 (2013.01);
Abstract
A liquid resin molding system has a stationary platen and a movable platen mounted for undergoing movement relative to the stationary platen. A mold has at least one cavity and includes a first mold member attached to the movable platen and a second mold member attached to the stationary platen. An injection nozzle is attached to the movable platen and is configured to receive a liquid resin and to inject the liquid resin into the mold cavity. A nozzle touch mechanism is attached to the movable platen for pressing the injection nozzle against the mold.