The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Sep. 06, 2011
Applicants:
Eiji Toyoda, Osaka, JP;
Shigetomi Kido, Mie, JP;
Inventors:
Eiji Toyoda, Osaka, JP;
Shigetomi Kido, Mie, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 24/75 (2013.01); H01L 2224/73203 (2013.01); H01L 2924/10253 (2013.01);
Abstract
A method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.
Toyoda, Eiji. (2015). Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation (U.S. Patent No. 8938878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8938878
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile