The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
May. 14, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Do-yoon Kim, Hwaseong-si, KR;
Yong-chul Kim, Seoul, KR;
Il-hwan Kim, Seoul, KR;
Shang-hyeun Park, Yongin-si, KR;
Tae-won Jeong, Yongin-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 35/06 (2006.01); H01J 29/50 (2006.01); H01J 19/24 (2006.01); H01J 1/02 (2006.01); H01J 3/02 (2006.01); H01J 31/12 (2006.01); H01J 63/02 (2006.01); H01J 9/02 (2006.01); H01J 63/06 (2006.01); B82Y 99/00 (2011.01);
U.S. Cl.
CPC ...
H01J 19/24 (2013.01); H01J 35/065 (2013.01); H01J 1/02 (2013.01); H01J 35/06 (2013.01); H01J 3/021 (2013.01); H01J 31/127 (2013.01); H01J 63/02 (2013.01); H01J 9/02 (2013.01); H01J 63/06 (2013.01); H01J 2235/062 (2013.01); H01J 2235/068 (2013.01); B82Y 99/00 (2013.01); Y10S 977/939 (2013.01); H01J 2203/0208 (2013.01); H01J 2329/4608 (2013.01);
Abstract
A mesh electrode adhesion structure includes: a substrate, and an opening defined in the substrate; a mesh electrode on the substrate, and a first combination groove defined in the mesh electrode; and an adhesion layer between the substrate and the mesh electrode. The mesh electrode includes: a mesh region corresponding to the opening defined in the substrate, and an adhesion region in which the first combination groove exposes the adhesion layer.