The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2015

Filed:

Dec. 06, 2013
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Haykel Ben Jamaa, Grenoble, FR;

Xavier Baillin, Crolles, FR;

Emmanuel Ollier, Grenoble, FR;

Ulrich Soupremanien, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 23/427 (2006.01); H05K 13/04 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); H01L 23/4275 (2013.01); H05K 13/04 (2013.01); H01L 23/3121 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKgKat a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.


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