The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
Dec. 26, 2013
Seiko Epson Corporation, Tokyo, JP;
Kosuke Wakamatsu, Chino, JP;
Nobuhiro Naito, Chino, JP;
Satoshi Nagatoya, Azumino, JP;
Michiya Nakamura, Azumino, JP;
Takeshi Yasoshima, Matsumoto, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A liquid ejecting head suppresses erosion of silicon substrates by liquid, and whereby suppresses leakage of liquid, discharging failure of liquid droplets, and peeling-off of laminated substrates. The liquid ejecting head includes at least a nozzle plate on which nozzle openings for discharging liquid are provided, and a flow path formation substrate on which a pressure generation chamber communicating with the nozzle openings is provided. The nozzle plate is formed with a silicon substrate. At least the flow path formation substrate and the nozzle plate are bonded to each other after providing a tantalum oxide film formed by atomic layer deposition on the entire surfaces including a bonded surface.