The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
Jan. 12, 2011
Applicants:
Sohei Samejima, Tokyo, JP;
Hajime Takeya, Tokyo, JP;
Hiroyuki Osuga, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 25/14 (2006.01); B32B 27/04 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 25/14 (2013.01); B32B 27/04 (2013.01); H05K 3/022 (2013.01); H05K 3/4608 (2013.01); H05K 1/0271 (2013.01); B32B 2305/076 (2013.01); B32B 2311/12 (2013.01); B32B 2457/08 (2013.01); H05K 1/0366 (2013.01); H05K 3/429 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0358 (2013.01); H05K 3/4632 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0281 (2013.01);
Abstract
A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.