The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Aug. 01, 2011
Applicants:

Todd Eckhardt, Westerville, OH (US);

Jim Machir, Columbus, OH (US);

Palani Thanigachalam, Bangalore, IN;

Sunil Job, Thiruvananthapuram, IN;

Inventors:

Todd Eckhardt, Westerville, OH (US);

Jim Machir, Columbus, OH (US);

Palani Thanigachalam, Bangalore, IN;

Sunil Job, Thiruvananthapuram, IN;

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 7/00 (2006.01); G01L 9/00 (2006.01); H01R 29/00 (2006.01); H02B 1/056 (2006.01); H01R 13/40 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); G01L 9/16 (2006.01); H01R 12/58 (2011.01); H01R 12/52 (2011.01); H01R 13/64 (2006.01);
U.S. Cl.
CPC ...
G01L 9/00 (2013.01); H01R 12/585 (2013.01); H01R 12/523 (2013.01); H05K 1/144 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10303 (2013.01); H01R 13/64 (2013.01);
Abstract

The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.


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