The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

May. 30, 2012
Applicants:

Boris Reynov, Cupertino, CA (US);

Jack Kohn, Mountain View, CA (US);

Victor Mei, Palo Alto, CA (US);

Shreeram Siddhaye, Sunnyvale, CA (US);

Ben Nitzan, El Granada, CA (US);

Venkata Penmetsa, Cupertino, CA (US);

Inventors:

Boris Reynov, Cupertino, CA (US);

Jack Kohn, Mountain View, CA (US);

Victor Mei, Palo Alto, CA (US);

Shreeram Siddhaye, Sunnyvale, CA (US);

Ben Nitzan, El Granada, CA (US);

Venkata Penmetsa, Cupertino, CA (US);

Assignee:

Juniper Networks, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.


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