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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8934215 B1

PDFFull Text
Date of Patent:
Jan. 13, 2015

Filed:

Dec. 13, 2012

Laminated chip electronic component, board for mounting the same, and packing unit thereof

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Hang Kyu Cho, Suwon-si, KR;

Young Ghyu Ahn, Suwon-si, KR;

Jae Yeol Choi, Suwon-si, KR;

Doo Young Kim, Suwon-si, KR;

Seok Hyun Yoon, Suwon-si, KR;

Ji Young Park, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd, Suwon, Gyunggi-Do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 4/228 (2006.01); H01G 4/20 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/2045 (2013.01);
Abstract

A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.

Find Patent Forward Citations

Cho, Hang. (2015). Laminated chip electronic component, board for mounting the same, and packing unit thereof (U.S. Patent No. 8934215). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8934215

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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