The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Dec. 30, 2013
Sae Magnetics (H.k.) Ltd., Hong Kong, CN;
Xian Wen Feng, DongGuan, CN;
Tan Tian, DongGuan, CN;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
A flexure includes a substrate layer, a dielectric layer formed thereon, and a conducting layer formed on the dielectric layer, the conducting layer includes multiple conductive traces and multiple bonding pads arranged in a first direction and adapted for connecting with a PCB, each bonding pad includes a first portion and a second portion, a first window is opened on the substrate layer, and a second window is opened on the dielectric layer to expose the bonding pads, wherein the substrate layer includes multiple first protuberances extending from at least one side wall of the first window along a second direction which is perpendicular to the first direction to cover the first portion of each bonding pad, and the second portion of each bonding pad includes at least one notch or hole. The flexure is applicable to connected with a PCB by soldering jetting process or hot bar process.