The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Feb. 15, 2012
Applicants:

Merijn Keser, Eindhoven, NL;

Wouter Oepts, Eindhoven, NL;

Edwin Petrus Helena Van Lier, Eindhoven, NL;

Ralph Hubert Peters, Eindhoven, NL;

Inventors:

Merijn Keser, Eindhoven, NL;

Wouter Oepts, Eindhoven, NL;

Edwin Petrus Helena Van Lier, Eindhoven, NL;

Ralph Hubert Peters, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/64 (2010.01); H05B 33/02 (2006.01); F21V 19/00 (2006.01); F21V 29/00 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
H05B 33/02 (2013.01); F21V 19/001 (2013.01); F21V 29/004 (2013.01); F21Y 2101/02 (2013.01); F21V 29/20 (2013.01); F21V 29/246 (2013.01);
Abstract

A light-emitting device (), comprising an LED-module () comprising at least one LED mounted on a carrier and at least one connection pad (-) for electrical connection of the LED module (), a heat dissipator () for dissipating heat generated by the LED when in operation, a connection board () comprising a substrate having a conductor pattern for enabling provision of external power to the LED module (), an interconnecting arrangement (-) comprising at least one connection spring (-) attached to the connection board () electrically interconnecting the at least one connection pad (-) of the LED module () with the conductor pattern of the connection board (), and an LED-holder comprising at least one holding spring (-) attached to the connection board () exerting a spring force there by pressing the LED-module () against the heat dissipator () to provide a thermal connection between the LED-module () and the heat dissipator (). The interconnecting arrangement (-) is configured to allow movement between the conductor pattern of the connection board () and the at least one connection pad (-). The at least one connection spring (-) constitutes the at least one holding spring (-), to simultaneously electrically interconnect the at least one connection pad (-) of the LED-module () with the conductor pattern of the connection board () and press the LED-module () against the heat dissipator ().


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