The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Apr. 02, 2013
Infineon Technologies Ag, Neubiberg, DE;
Thilo Stolze, Arnsberg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A pressure contact arrangement includes a pressure contact device having an upper contact piece and a lower contact piece, one or more vertical first semiconductor chips and a peripherally closed adhesive bead. Each vertical first semiconductor chip has an upper side, a lower side opposite the upper side, a peripherally closed narrow side adjoining the upper side and the lower side and connecting the upper and lower sides, an upper electrical contact face arranged on the upper side, and a lower electrical contact face arranged on the lower side. The peripherally closed adhesive bead surrounds each vertical first semiconductor chip and fastens each vertical first semiconductor chip to the pressure contact device. A peripherally closed connecting face is provided between each adhesive bead and the narrow side of the corresponding vertical first semiconductor chip that laterally surrounds the vertical first semiconductor chip.