The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Oct. 19, 2010
Tsuyoshi Takayama, Tokyo, JP;
Yukio Yasuda, Tokyo, JP;
Hajime Kato, Tokyo, JP;
Kazuaki Hiyama, Tokyo, JP;
Taishi Sasaki, Tokyo, JP;
Mikio Ishihara, Tokyo, JP;
Tsuyoshi Takayama, Tokyo, JP;
Yukio Yasuda, Tokyo, JP;
Hajime Kato, Tokyo, JP;
Kazuaki Hiyama, Tokyo, JP;
Taishi Sasaki, Tokyo, JP;
Mikio Ishihara, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.